Facture of this cooler is discussable. Somebody could say, that some mistakes of beauty are disadvantage for saleability, somebody that no.

     



Base plate - easy said: ragged surface - because of high machining speed, but its evenness considering to ragged surface is not bad. Some oil spots at CPU contact area can be easy cleaned with alcohol or acetone.

   

After I finished temperature tests, I grinded surface area. Results are on photo - this is better I think - am I right?

   

There are mounted three dual heat pipes at the base plate They are bowed so nice and with care.

   

Heat pipes are tinned to base plate for better heat transfer. Soldered joints look for the first time, that they are soldered with not enough quantity of tin. It is enough and cooler have high power.

     

Cooling fins are also "invisible" soldered to the heat pipes - pictures 1 and 2. But for good heat transfer it is also enough. Any movements of fins at heat pipes are impossible. Soldered joints are well shown at 3rd and 4th pictures.

     

Heat pipes are originally but maybe not so nice terminated. Base plate and cooling fins are without any flashes after tooling. Cooling ribs are well secured against to vibrations and bending by fastener at the sides. Montage of this cooler to the mother board needs about half hour and it is pretty easy. Cooler can be turned by 90o for optimal cooling and compatibility. That means four possible montage positions

   

Here are photos of all three montage sets and all rest rules are in operating instructions.

   

Some poses with motherboard.

 

Here it is good shown, that cooler stays in not-restricted area. Its position is according to the PSU, RAM modules and passive chipset cooling ok.

 

Lower cooling ribs could be in curved to supply the chipset cooler with cold air outgoing from cooler. Coolers base is not in electrolytic capacitors and smd components area.